M6 High Speed Low Loss Multilayer Printed Circuit Board (Megtron 6 PCB)
(Printed Circuit Boards are custom-made products; the images and parameters shown are for reference only)
Product Overview
Introducing the M6 High Speed Low Loss Multilayer Printed Circuit Board, specifically the R-5775 model. Megtron 6 is engineered for exceptional performance in mobile, networking, and wireless applications, characterized by its ultra-low loss and high heat resistance.
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Key Properties
Low Dielectric Constant (Dk): 3.7 (@ 1GHz)
Low Dielectric Dissipation Factor (Df): 0.002 (@ 1GHz)
Enhanced Reliability: Excellent through-hole reliability, outperforming conventional high Tg FR-4 materials by five times.
Compliance: Lead-free and ROHS-compliant soldering.
High Heat Resistance: Designed to withstand elevated temperatures
High-Density Interconnect (HDI): Outstanding thermal performance and interconnect capabilities.
PCB Capabilities (Megtron 6)
| PCB Capability (Megtron6) | |
| PCB Material: | Low DK Glass Cloth |
| Designation: | Laminate R-5775(G), Prepreg R-5670(G) |
| Dielectric constant: | 3.61 10GHz |
| Dissipation Factor | 0.004 10GHz |
| Layer count: | Multilayer PCB, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.6mm, 1.8mm, 2.0mm |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, ENEPIG, OSP, Pure gold etc.. |
Main Applications
The M6 PCB is suitable for a variety of applications, including:
Antennas (for automotive millimeter-wave radar and base stations)
ICT infrastructure equipment
Measuring instruments
Supercomputers
Typical Values of R-5775
| Property | Units | Test Method | Condition | Typical Value | ||
| THERMAL | Glass Transition Temp ( Tg ) | C | DSC | As received | 185 | |
| DMA | As received | 210 | ||||
| Thermal Decomposition Temp | C | TGA | As received | 410 | ||
| Time to Delam (T288) | Without Cu | Min | IPC TM-650 2.4.24.1 | As received | > 120 | |
| With Cu | Min | IPC TM-650 2.4.24.1 | As received | > 120 | ||
| CTE : α1 | X - axis ppm / C | ppm / C | IPC TM-650 2.4.24 | < Tg | 14 - 16 | |
| Y - axis ppm / C | ppm / C | IPC TM-650 2.4.24 | < Tg | 14 - 16 | ||
| Z - axis ppm / C | ppm / C | IPC TM-650 2.4.24 | < Tg | 45 | ||
| CTE : α2 | Z - axis ppm / C | ppm / C | IPC TM-650 2.4.24 | > Tg 260 | 260 | |
| ELECTRICAL | Volume Resistivity | MΩ - cm | IPC TM-650 2.5.17.1 | C-96/35/90 | 1 x 109 | |
| Surface Resistivity | MΩ | IPC TM-650 2.5.17.1 | C-96/35/90 | 1 x 108 | ||
| Dielectric Constant ( Dk ) | @ 1GHz | / | IPC TM-650 2.5.5.9 | C-24/23/50 | 3.71 | |
| @ 10GHz | / | IPC TM-650 2.5.5.5 | C-24/23/50 | 3.61 | ||
| Dissipation Factor ( Df ) | @ 1GHz | / | IPC TM-650 2.5.5.9 | C-24/23/50 | 0.002 | |
| @ 10GHz | / | IPC TM-650 2.5.5.5 | C-24/23/50 | 0.004 | ||
| PHYSICAL | Water Absorption | % | IPC TM-650 2.6.2.1 | D-24/23 | 0.14 | |
| Peel Strength | 1oz ( H-VLP ) | kN / m | IPC TM-650 2.4.8 | As Received 0.8 | 0.8 | |
| Flammability | / | UL | C-48/23/50 | 94V-0 | ||
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Megtron 6 Material Inventory
Conclusion
We are committed to providing prototypes, small batches, and mass production PCBs tailored to your needs. For any inquiries, please feel free to contact us.
Thank you for considering our M6 High Speed Low Loss Multilayer Printed Circuit Board for your next project!